Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
POE & EVA co-extruded adhesive film
Excellent water vapor barrier performance
Weather resistance
Higher cost advantage
Better anti-PID characteristics
Better peel strength retention
Type: | Fast Cure | Tensile Strength: | 10 MPa |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Thermoplastic TPO adhesive film
Suitable for perovskite, CIGS, and lightweight components
Low laminate temperature short time
High weather resistance
Low water vapor transmittance
High transmittance
No small molecules are released
Type: | Fast Cure | Tensile Strength: | 10 MPa |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Thermoplastic tpo adhesive film
Has the advantages of low packaging temperature and low water vapor transmission rate
Maintains excellent weather resistance and good adhesion
Suitable for perovskite, cigs, lightweight components.
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Cross-linked poe encapsulation film
Has excellent water vapor barrier property and weather ability
Has better anti-pid performance and better peeling strength retention.
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Co-extrusion white poe film
Perc、topcon single/double glass photovoltaic module
Reduce white film spillage after component lamination
Low water vapor transmission rate
Reduce micro-cracks during cell lamination
High reflectivity retention
High weather resistance
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Hjt integrated encapsulation film
Reduce delamination after aging and has perfect shaping effect on solder strip
Has positioning function on solder strip
Reduces the process of low temperature welding and reduce the use of silver paste
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Hjt integrated encapsulation film
Reduce delamination after aging and has perfect shaping effect on solder strip
Has positioning function on solder strip
Reduces the process of low temperature welding and reduce the use of silver paste
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
High transmittance eva encapsulation film
Provides strong and stable adhesion performance
Excellent long-term resistance to heat and humidity,UV and PID resistance
Perfect matching with various components and auxiliary materials
Good process compatibility with most laminating equipment.
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Ultra-low pre-crosslinking white adhesive film for high barrier packages
Hjt、perc、topcon single glass photovoltaic module
Type: | Fast Cure | Tensile Strength: | -- |
Thickness: | 0.2 ~ 0.8 mm | Thermal Shrinkage (Length / MD) ≤: | 3 % |
Region: | China |
Black infrared reflective encapsulation film
Improve the effective utilization rate of visible light
Help to increase the power yield of the module
Solve the problem of black film overflow after laminated
Has high reflectivity retention rate and low attenuation rate on peel strength